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NextFlex to Issue Project Call 4.0 on Aug. 6

Topics include encapsulation technologies for wearables, e-textiles, biochemical monitoring platforms.

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World, Coatings World and Ink World Magazine

NextFlex’s Project Call 4.0 (PC 4.0) is scheduled for release on Monday, Aug. 6, 2018. Here’s what’s in store:
 
PC 4.0 will continue to focus on the areas identified in the Flexible Hyrid Electronics (FHE) Roadmap developed by NextFlex Technical Working Groups. This roadmap is developed by industry, government, nonprofit, and academic subject matter experts, and reviewed by the Institute’s Technical and Governing Councils.
 
Topics for this latest project call have a diverse scope that represents technology and capability gaps that have been determined by the community over a wide range of application areas ranging from digital health to commercial aviation to national security needs. These areas traverse the spectrum from encapsulation technologies for wearables, to high performance and high layer count FHE to 3-dimensional electronic design software, to solutions for challenges in e-textiles as well as biochemical monitoring platforms and lightweight electronics for drones and UAVs.
 
Interested people can learn more at the following events:
 
• Aug. 7: PC 4.0 Webinar taking place online at 11:00 a.m. Pacific (2:00 p.m. Eastern)
• Aug. 8: PC 4.0 Overview and Topic Networking session—for NextFlex members only—taking place at 3:45 p.m., during Innovation Week at NextFlex, San Jose, CA
 
The August 7th PC 4.0 Webinar is open to all.

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